NYCU ECE and IEEE Taipei Section Host 2025 AI Computing Workshop to Explore the Future of High-Performance AI Systems

(中央社訊息服務20251031 16:36:42)The College of Electrical and Computer Engineering (ECE) at National Yang Ming Chiao Tung University (NYCU), in collaboration with the IEEE Taipei Section, hosted the 2025 AI Computing Workshop featuring AMD as the keynote industry partner. The workshop centered on the rapid evolution of artificial intelligence and the latest breakthroughs in high-performance computing.

In his opening remarks, Professor Li-Chun Wang, Dean of NYCU ECE College and Chair of the IEEE Taipei Section, highlighted the event as a milestone in deepening dialogue between Taiwan’s academic community and global technology leaders. He emphasized that the College is driven by its vision of CICS — Connect Intelligence in Chips and Systems, aiming to advance human civilization through research and education.

“AI is not merely a tool—it is an enabler of dreams,” Wang said. “Through open architectures, we can create an awe-inspiring future and help humanity reclaim a civilization centered on human values.”

NYCU continues to lead Taiwan’s innovation in electrical and computer engineering—founding the nation’s first Institute of Electronics and College of Electrical and Computer Engineering, and more recently, establishing the Department of Semiconductor Engineering and two frontier programs: the Master’s Program in Quantum Science and Engineering and the Interdisciplinary Master’s Program in Brain Technology and Engineering.

The NYCU also launched the Pervasive AI Computing and Communications (PACC) Lab, fostering pioneering research and co-creation between academia and industry.

Delivering the keynote address, Dr. David Wang, Senior Vice President of GPU Engineering at AMD, shared his insights on the accelerating complexity of AI models and their transformative impact on computing architectures. He noted that as AI models grow in scale and sophistication, new demands emerge for computation, memory, and interconnect technologies.

According to Wang, this moment marks a pivotal inflection point for the industry: “From 3D chiplet packaging to rack-scale integration built on open hardware and software ecosystems, AMD is rethinking system architecture to achieve the highest performance and energy efficiency. Collaboration between academia and industry will be key to sustaining this pace of innovation.”

Following his talk, Ken Lin, Senior Director of Commercial Business at AMD Taiwan, underscored that AI is reshaping every industry—and that cross-regional collaboration is essential for building a resilient AI ecosystem.

“AMD works closely with Taiwan’s semiconductor, computing, and software partners to co-develop practical AI solutions,” Lin said. “This workshop showcases how academic research and industrial expertise can accelerate innovation and strengthen the global AI landscape.”

Looking ahead, NYCU ECE College will continue collaborating with the IEEE Taipei Section and industry partners to host forward-looking forums and training programs. By fostering interdisciplinary research and cultivating top AI talent, NYCU aims to expand Taiwan’s influence within the global AI technology ecosystem.